Quasi-in-situ Observation of Interfacial Behaviours: Recrystallization and Grain Recombination during Micro-deformed Diffusion Bonding Process

doi:10.1007/s40195-023-01604-w

Abstract

Abstract:

The interfacial behaviours of micro-deformed diffusion bonded joints were systematically revealed. There were two typical bonding interfacial characteristics: “bond line” and migrated grain boundaries. “Bond line” was featured as fine grains and phases on the interface. The critical temperature of joint characterized by “bond line” was 950 °C. The increased temperature 1000 °C was a critical temperature which interfacial characteristic “bond line” eliminated. The second type was characterized by interfacial migration over 1000 °C, in which the bonding interfaces were composed of straight grain boundaries, triple junctions, and protruding and expanding interfacial migrated grains. Additionally, two different interface migration and joint forming mechanisms were observed with elevated bonding temperature: recrystallization and grain recombination. The first one was the discontinuous dynamic recrystallization mechanism, which was observed in the joints bonded at 950 °C and 1000 °C. The second mechanism was the grain boundary migration mechanism based on the grain growth mechanism, of which the typical bonding temperature was 1050 °C. The joint was bonded under two kinds of grain boundary migration, including strain-induced interface grain boundary migration and interface grain boundary migration at triple junction.

Key words: Diffusion bonding, Critical bonding temperature, Interfacial microstructure, Dynamic recrystallization, Grain recombination

Yu Peng, Shiwei Li, Feng Jin, Yipeng Chen, Wei Guo, Jiangtao Xiong, Jinglong Li. Quasi-in-situ Observation of Interfacial Behaviours: Recrystallization and Grain Recombination during Micro-deformed Diffusion Bonding Process[J]. Acta Metallurgica Sinica (English Letters), 2023, 36(12): 2031-2044.

Figures/Tables 13

Table 1 Chemical composition of SUS 304 austenitic stainless steel (wt%)

Fe	Cr	Ni	Mn	Si	C	P	S
Bal.	18	10	2	≤ 1	≤ 0.1	≤ 0.05	≤ 0.03

Fig. 1 Characteristics of 304 base metal: a microstructural characteristic, b IPF image

Table 2 Diffusion bonding process parameters

Process parameters	Bonding temperature (°C)	Bonding pressure (MPa)	Holding time (min)
Parameter values pairing 1	900	10	60
	950
	1000
	1050
	1100
Parameter values pairing 2	950	10	60
		30
		50
Parameter values pairing 3	950	10	5
			15
			60
			90
Parameter values pairing 4	1000	10	5
			15
			60
Parameter values pairing 5	1050	10	1
			5
			15
			60
			90

Fig. 2 Interfacial microstructure and grain size variation of joint bonded under 10 MPa for 60 min at different temperatures: a 900 ℃, b 950 ℃, c 1000 ℃, d 1050 ℃, e 1100 ℃, f the variation of grain size. BI: Bonding interface

Fig. 3 EPMA mapping and phases distribution of joint bonded at 950 °C under 10 MPa for 60 min: a microstructure, b Fe element distribution, c Cr element distribution, d C element distribution, e the phases distribution identified by EBSD technique

Fig. 4 Evolution of interfacial microstructure over time for joints bonded at different bonding temperatures: a 950 °C/10 MPa/5 min, b 950 °C/10 MPa/15 min, c 950 °C/10 MPa/60 min; d 1000 °C/10 MPa/5 min, e 1000 °C/10 MPa/15 min, f 1000 °C/10 MPa/60 min; g 1050 °C/10 MPa/5 min, h 1050 °C/10 MPa/15 min, i 1050 °C/10 MPa/60 min

Fig. 5 EBSD results of joints bonded at 950 °C under 10 MPa for different bonding time: the interfacial recrystallization distribution of joints bonded for a 5 min, c 15 min, e 60 min, g 90 min; KAM of joints bonded for b 5 min, d 15 min, f 60 min, h 90 min; i the misorientation angle distribution across the testing line, j the evolution of misorientation angle distribution of joints with bonding time

Fig. 6 Evolution of microstructure for the joints bonded at 1050 °C under 10 MPa for a 1 min, b 5 min, c 15 min, d 60 min; e the evolution of grain size with bonding time, f KAM image of joints boned for 5 min and 60 min

Fig. 7 Interfacial microstructure characteristic of joints bonded at 1050 °C under 10 MPa: Grain boundary bulging migration of the joint bonded for 1 min a region 1, b region 2, c sketch map of strain-induced interface grain boundary migration; Interface grain boundary migration at triple junction of the joint bonded for 5 min d region 1, e region 2, f sketch map of interface grain boundary migration at triple junction

Fig. 8 Microstructure of joints bonded at different increased bonding temperature, pressure, and holding time under the condition of: a 975 °C/10 MPa/60 min, b 1000 °C/10 MPa/60 min, c 1050 °C/10 MPa/60 min, d 950 °C/10 MPa/90 min, e 950 °C/10 MPa/60 min, f 950 °C/30 MPa/60 min, g 950 °C/50 MPa/120 min, magnified micrographies g1 and g2

Fig. 9 Deformation ratio of joints bonded at different conditions

Fig. 10 Schematic diagram showing the characteristic and evolution of interfacial microstructure for 304 stainless steel joints diffusion bonded at increasing temperature

Fig. 11 Deformation strain, strain rate, and phase content with bonding temperature: a the evolution of strain with time at different bonding temperatures under 10 MPa, b the evolution of strain rate with time at different bonding temperatures, c change of phase content with temperature, d the relationship of normalization temperature (T/Tm) and temperature (T). Tm: Melting point, Tr: recrystallization starting temperature, Tg: Grain growing temperature

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