Acta Metallurgica Sinica (English Letters) ›› 2023, Vol. 36 ›› Issue (10): 1603-1618.DOI: 10.1007/s40195-023-01575-y

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Low-Temperature Diffusion Bonding Behavior of Hydrogenated Zr R60702

Jialin Zheng1, Longteng Li2, Huiping Wu1, Doudou Yang3, Bin Wang3, Dayong An1, Xifeng Li1()   

  1. 1Institute of Forming Technology and Equipment, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200030, China
    2Luoyang Ship Material Research Institute, Luoyang, 471023, China
    3Beijing Xinghang Electro-Mechanical Equipment Co., Ltd., Beijing, 100074, China
  • Received:2023-02-21 Revised:2023-03-29 Accepted:2023-04-25 Online:2023-10-10 Published:2023-07-08
  • Contact: Xifeng Li, lixifeng@sjtu.edu.cn

Abstract:

High temperature in diffusion bonding (DB) process severely deteriorates the performance of zirconium (Zr) R60702 in extreme chemical environment. Therefore, it is important to reduce the DB temperature of Zr R60702. In this work, low-temperature diffusion bonding of Zr R60702 at 750 °C is realized by 0.3 wt% hydrogen addition while 900 °C is required in DB process for unhydrogenated Zr R60702. The shear strength of the hydrogenated joint bonded at 750 °C reaches 388 MPa, which is 117.98% higher than that of the unhydrogenated joint bonded at 750 °C and equal to that of the unhydrogenated joint bonded at 900 °C. The effects of hydrogen addition in Zr R60702 on the microstructure evolution, phase transformation temperature, interatomic bonding and self-diffusion coefficient of Zr atoms are investigated in detail. The results show that the optimized DB properties can be attributed to the improvements of its grain boundary diffusion, plasticity and self-diffusion coefficient of Zr atoms.

Key words: Low-temperature diffusion bonding, Hydrogenation, Zr R60702