Acta Metallurgica Sinica (English Letters) ›› 2021, Vol. 34 ›› Issue (10): 1331-1344.DOI: 10.1007/s40195-021-01231-3
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Mingfan Qi1, Yonglin Kang1, Jingyuan Li1(), Yuzhao Xu1, Jicheng Wang2, Gunan Li2, Aisen Liu3
Received:
2020-10-24
Revised:
2020-12-26
Accepted:
2021-01-01
Online:
2021-10-10
Published:
2021-05-24
Contact:
Jingyuan Li
About author:
Jingyuan Li, lijy@ustb.edu.cnMingfan Qi, Yonglin Kang, Jingyuan Li, Yuzhao Xu, Jicheng Wang, Gunan Li, Aisen Liu. Synchronously Improving the Thermal Conductivity and Mechanical Properties of Al-Si-Fe-Mg-Cu-Zn Alloy Die Castings Through Ultrasonic-Assisted Rheoforming[J]. Acta Metallurgica Sinica (English Letters), 2021, 34(10): 1331-1344.
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Fig. 2 Physical map a, local section size b and three-dimensional graphs c, d of die castings; e, f die-casting die of the large thin-walled 5G base station heat dissipation shells
Fig. 4 Microstructures of the Al-Si-Fe-Mg-Cu-Zn alloy at positions A and B prepared by different processes: a, b T-DC, c, d ACSR R-DC, e, f ACSR + UV R-DC, g the corresponding characteristic values
Fig. 5 SEM images of the eutectic microstructure of the Al-Si-Fe-Mg-Cu-Zn alloys prepared by different processes: a T-DC, b ACSR R-DC, c ACSR + UV R-DC; d XRD of these three alloys
Fig. 6 Density and porosity a, stress-strain curve b, and thermal conductivity c of the Al-Si-Fe-Mg-Cu-Zn alloys prepared by the T-DC, ACSR R-DC and ACSR + UV R-DC processes, d the comparison of ultimate tensile strength, elongation, thermal conductivity between the ACSR + UV R-DC alloy and several traditional R-DC alloys
Fig. 8 Schematic diagram of the microstructure formation process of the Al-Si-Fe-Mg-Cu-Zn alloys prepared by the T-DC, ACSR R-DC and ACSR + UV R-DC processes
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