Achieving High Strength and High Electrical Conductivity in a CuCrZr Alloy Using Equal-Channel Angular Pressing

doi:10.1007/s40195-018-0766-9

Abstract

Abstract:

In the present work, a CuCrZr alloy characterized by ultrafine grains and nanoscale particles was prepared by equal-channel angular pressing (ECAP) at 450 °C. A desired combination of a tensile strength (580 MPa) and an electrical conductivity (81% International Annealed Copper Standard) is simultaneously obtained in the as-ECAP-processed CuCrZr alloy without additional aging treatment. The improved properties can be mainly attributed to the ultrafine grains and nanoscale precipitates. This processing may pave a way to develop the CuCrZr alloys having high strength and high electrical conductivity for engineering applications.

Key words: Microstructure, CuCrZr, Equal-channel angular pressing, Strengthening

Yun-Xiang Tong, Yu Wang, Zhi-Min Qian, Dian-Tao Zhang, Li Li, Yu-Feng Zheng. Achieving High Strength and High Electrical Conductivity in a CuCrZr Alloy Using Equal-Channel Angular Pressing[J]. Acta Metallurgica Sinica (English Letters), 2018, 31(10): 1084-1088.

Figures/Tables 5

Fig. 1 SEM image of the initial CuCrZr alloy

Fig. 2 TEM images of the as-ECAP-processed CuCrZr alloy a, b, selected area electron diffractions c, d

Fig. 3 a Effect of pass number on the microhardness and electrical conductivity of the CuCrZr alloys processed at 450 °C, b typical stress-strain curves of the alloys before and after ECAP

Fig. 4 Tensile strength and electrical conductivity of CuCrZr alloys processed by ECAP without additional aging treatment. The data were obtained from the present work and the reported results

Table 1 UTS and electrical conductivity of some as-ECAP-processed CuCrZr alloys

Alloy	Processing	UTS (MPa)		Electrical conductivity (% IACS)		References
Alloy	Processing	Initial value	After ECAP	Initial value	After ECAP	References
Cu-0.36Cr-0.49Zr	ST?+?ECAP at 450 °C for 8 passes	303	580	48	81	Present work
Cu-0.8Cr-0.08Zr	ST?+?ECAP at RT for 8 passes	189	618	67	35	[2]
Cu-0.3Cr-0.5Zr	ST?+?ECAP at 400 °C for 4 passes	200^a	510^a	34^a	31^a	[16]
Cu-0.3Cr-0.5Zr	Aging?+?ECAP at 400 °C for 4 passes	330^a	575^a	48^a	34^a	[16]
Cu-0.87Cr-0.06Zr	ST?+?ECAP at 200 °C for 12 passes	365	550	79	68^a	[19]
	ST?+?ECAP at 300 °C for 12 passes	365	520	79	66^a
	ST?+?ECAP at 400 °C for 12 passes	365	465	79	74^a

References

[1]	J.H. Su, H.J. Li, Q.M. Dong, P. Liu, B.X. Kang, B.H. Tian, Acta Metall. Sin. (Engl. Lett.) 17, 741(2004)
[2]	G. Purcek, H. Yanar, O. Saray, I. Karaman, H.J. Maier, Wear 311, 149 (2014)
[3]	M.Y. Murashkin, I. Sabirov, X. Sauvage, R.Z. Valiev, J. Mater. Sci. 51, 33(2016)
[4]	Y. Zhang, H.L. Sun, A.A. Volinsky, B.H. Tian, Z. Chai, P. Liu, Y. Liu, Acta Metall. Sin. (Engl. Lett.) 29, 422(2016)
[5]	D.V. Shangina, N.R. Bochvar, A.I. Morozova, A.N. Belyakov, R.O. Kaibyshev, S.V. Dobatkin, Mater. Lett. 199, 46(2017)
[6]	Y. Zhang, A.A. Volinsky, H.T. Tran, Z. Chai, P. Liu, B. Tian, Y. Liu, Mater. Sci. Eng. A 650, 248 (2016)
[7]	J.H. Su, Q.M. Dong, P. Liu, H.J. Li, B.X. Kang, Mater. Sci. Eng. A 392, 422 (2005)
[8]	A. Vinogradov, V. Patlan, Y. Suzuki, K. Kitagawa, V.I. Kopylov, Acta Mater. 50, 1639(2002)
[9]	J.B. Correia, H.A. Davies, C.M. Sellars, Acta Mater. 45, 177(1997)
[10]	I.S. Batra, G.K. Dey, U.D. Kulkarni, S. Banerjee, J. Nucl. Mater. 299, 91(2001)
[11]	Q. Liu, X. Zhang, Y. Ge, J. Wang, J.Z. Cui, Metall. Mater. Trans. A 37, 3233 (2006)
[12]	R.Z. Valiev, T.G. Langdon, Prog. Mater Sci. 51, 881(2006)
[13]	M. Kulczyk, B. Zysk, M. Lewandowska, K.J. Kurzyd?owski, Phys. Status Solidi A 207, 1136 (2010)
[14]	G. Purcek, H. Yanar, M. Demirtas, Y. Alemdag, D.V. Shangina, S.V. Dobatkin, Mater. Sci. Eng. A 649, 114 (2016)
[15]	L.X. Sun, N.R. Tao, K. Lu, Scr. Mater. 99, 73(2015)
[16]	A.P. Zhilyaev, I. Shakhova, A. Morozova, A. Belyakov, R. Kaibyshev, Mater. Sci. Eng. A 654, 131 (2016)
[17]	P. Liu, B.X. Kang, X.G. Cao, J.L. Huang, B. Yen, H.C. Gu, Mater. Sci. Eng. A 265, 262 (1999)
[18]	K.X. Wei, W. Wei, F. Wang, Q.B. Du, I.V. Alexandrov, J. Hu, Mater. Sci. Eng. A 528, 1478 (2011)
[19]	R. Mishnev, I. Shakhova, A. Belyakov, R. Kaibyshev, Mater. Sci. Eng. A 629, 29 (2015)
[20]	R.K. Islamgaliev, K.M. Nesterov, J. Bourgon, Y. Champion, R.Z. Valiev, J. Appl. Phys. 115, 194301(2014)
[21]	G.J. Raab, R.Z. Valiev, T.C. Lowe, Y.T. Zhu,Mater. Sci. Eng. A 382, 30 (2004)