Acta Metallurgica Sinica (English Letters) ›› 2017, Vol. 30 ›› Issue (2): 176-184.DOI: 10.1007/s40195-017-0536-0
Special Issue: 2017-2018薄膜和涂层专辑
• Orginal Article • Previous Articles Next Articles
Sheng-Sheng Zhao1(),Yan-Hui Zhao2,Lv-Sha Cheng1,Vladimir Viktorovich Denisov3,Nikolay Nikolaevich Koval3,Bao-Hai Yu2,Hai-Juan Mei1
Received:
2016-10-30
Online:
2017-02-17
Published:
2017-02-17
Sheng-Sheng Zhao,Yan-Hui Zhao,Lv-Sha Cheng,Vladimir Viktorovich Denisov,Nikolay Nikolaevich Koval,Bao-Hai Yu,Hai-Juan Mei. Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti-Cu-N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating[J]. Acta Metallurgica Sinica (English Letters), 2017, 30(2): 176-184.
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Fig. 5 A cross-sectional TEM micrographs and electron diffraction patterns of the Ti-Cu-N films with duty cycle of 10%, 50% and 80%, and a high-resolution photograph of the Ti-Cu-N film with duty cycle of 50%
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