Acta Metallurgica Sinica (English Letters) ›› 2014, Vol. 27 ›› Issue (1): 31-36.DOI: 10.1007/s40195-013-0004-4
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Xiangyang Chen1(), Jin Zhang1, Shengli Ma2, Haixia Hu1, Zhebo Zhou1
Received:
2013-05-03
Revised:
2013-08-23
Online:
2014-02-25
Published:
2014-03-11
Xiangyang Chen, Jin Zhang, Shengli Ma, Haixia Hu, Zhebo Zhou. Microstructure, Mechanical, and Tribological Properties of CNx Thin Films Prepared by Reactive Magnetron Sputtering[J]. Acta Metallurgica Sinica (English Letters), 2014, 27(1): 31-36.
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Parameter | TiN inter-layer | CNx film |
---|---|---|
Bias voltage (V) | -200 | -100 |
Substrate temperature (°C) | 300 | 250 |
N2/Ar ratio | 0.3 | 0.2–0.6 |
Ti target power (kW) | 2 | 0 |
Graphite target power (kW) | 0 | 4 |
Deposition time (min) | 30 | 120 |
Table 1 Deposition parameters for TiN inter-layer and CNx film deposition
Parameter | TiN inter-layer | CNx film |
---|---|---|
Bias voltage (V) | -200 | -100 |
Substrate temperature (°C) | 300 | 250 |
N2/Ar ratio | 0.3 | 0.2–0.6 |
Ti target power (kW) | 2 | 0 |
Graphite target power (kW) | 0 | 4 |
Deposition time (min) | 30 | 120 |
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