Acta Metallurgica Sinica (English Letters) ›› 2020, Vol. 33 ›› Issue (10): 1442-1454.DOI: 10.1007/s40195-020-01048-6
Kuiliang Zhang1,2, Yingju Li1,2, Yuansheng Yang1,2()
Received:
2019-12-20
Revised:
2020-03-09
Online:
2020-10-10
Published:
2020-10-20
Contact:
Yuansheng Yang
Kuiliang Zhang, Yingju Li, Yuansheng Yang. Simulation of the Influence of Pulsed Magnetic Field on the Superalloy Melt with the Solid-Liquid Interface in Directional Solidification[J]. Acta Metallurgica Sinica (English Letters), 2020, 33(10): 1442-1454.
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Fig. 1 Sketch of directional solidification equipment a, the liquid melt quenching sample with meniscus solid-liquid interface b, the finite element model c
- | Resistivity (Ω·m) | Permeability |
---|---|---|
Liquid | 1.19 $\times$ 10-6 | 1 |
Solid | 6 $\times$ 10-7 | 1 |
Coil | 2 $\times$ 10-8 | 1 |
Air | - | 1 |
Table 1 Material parameters for the electromagnetic simulation
- | Resistivity (Ω·m) | Permeability |
---|---|---|
Liquid | 1.19 $\times$ 10-6 | 1 |
Solid | 6 $\times$ 10-7 | 1 |
Coil | 2 $\times$ 10-8 | 1 |
Air | - | 1 |
Material | Temperature (K) | Density (kg/m3) | Thermal conductivity (J/(kg K)) | Enthalpy (kJ/kg) |
---|---|---|---|---|
Superalloy | 300 | 8150 | 10 | 592 |
1523 | 7800 | 30 | 844 | |
1613 | 7800 | 30 | 1130 | |
1800 | 7800 | 30 | 1243 | |
Mold | 300-1800 | 4000 | 6 | 1250 |
Table 2 Material parameters for the temperature simulation
Material | Temperature (K) | Density (kg/m3) | Thermal conductivity (J/(kg K)) | Enthalpy (kJ/kg) |
---|---|---|---|---|
Superalloy | 300 | 8150 | 10 | 592 |
1523 | 7800 | 30 | 844 | |
1613 | 7800 | 30 | 1130 | |
1800 | 7800 | 30 | 1243 | |
Mold | 300-1800 | 4000 | 6 | 1250 |
Fig. 3 A comparison of the experimentally measured and theoretically predicated radial variation in the axial velocity component at the height of 0.225 m
Fig. 8 Distribution of the magnetic pressure in the melt with the solid-liquid interface during the ascending stage a, during the descending stage b, during the pause stage c
Fig. 9 Distribution of the magnetic pressure in the melt without the solid-liquid interface during the ascending stage a, during the descending stage b, during the pause stage c
Fig. 11 Flow field with the solid-liquid interface at the end of the ascending stage a, at the end of the descending stage b, and the end of the pause stage c. The flow field without the solid-liquid interface at the end of the ascending stage d
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