Acta Metallurgica Sinica (English Letters) ›› 2019, Vol. 32 ›› Issue (11): 1407-1414.DOI: 10.1007/s40195-019-00875-6
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Lin Jiang1,2, Liang Zhang1,3, Zhi-Quan Liu1,2()
Received:
2018-10-20
Revised:
2018-12-02
Online:
2019-11-10
Published:
2019-11-10
Lin Jiang, Liang Zhang, Zhi-Quan Liu. Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method[J]. Acta Metallurgica Sinica (English Letters), 2019, 32(11): 1407-1414.
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Material | Thermal conductivity (W/(m K)) | CTE (10-6/K) | Young’s modulus (GPa) | Poisson’s ratio |
---|---|---|---|---|
Cobalt | 89.5 | 13.9 | 211 | 0.32 |
Copper | 396.0 | 16.5 | 128 | 0.34 |
Table 1 Material properties of cobalt and copper
Material | Thermal conductivity (W/(m K)) | CTE (10-6/K) | Young’s modulus (GPa) | Poisson’s ratio |
---|---|---|---|---|
Cobalt | 89.5 | 13.9 | 211 | 0.32 |
Copper | 396.0 | 16.5 | 128 | 0.34 |
Temperature (K) | 75 | 140 | 205 | 270 | 335 | 400 |
---|---|---|---|---|---|---|
Poisson’s ratio | 0.3 | |||||
Young’s modulus (GPa) | 19.11 | 17 | 14.89 | 12.78 | 10.66 | 8.55 |
CTE (10-6/K) | 23.9 | 26.9 | 28.27 | 30.46 | 32.65 | 34.83 |
Thermal conductivity (W/(m K)) | 99.83 | 94.37 | 89.03 | 83.82 | 78.74 | 73.78 |
Table 2 Material properties of indium [23]
Temperature (K) | 75 | 140 | 205 | 270 | 335 | 400 |
---|---|---|---|---|---|---|
Poisson’s ratio | 0.3 | |||||
Young’s modulus (GPa) | 19.11 | 17 | 14.89 | 12.78 | 10.66 | 8.55 |
CTE (10-6/K) | 23.9 | 26.9 | 28.27 | 30.46 | 32.65 | 34.83 |
Thermal conductivity (W/(m K)) | 99.83 | 94.37 | 89.03 | 83.82 | 78.74 | 73.78 |
Material | S0 (MPa) | Q/R (1/K) | A (1/s) | ξ | h0 (MPa) | m | ? | n | a |
---|---|---|---|---|---|---|---|---|---|
Indium | 28.30 | 9369.7 | 2.33E8 | 49.97 | 0 | 0.300 | 28.30 | 0 | 1 |
Sn3.0Ag0.5Cu | 40.16 | 8400.0 | 4.61E6 | 4.60 | 3090.00 | 0.162 | 14.37 | 0.038 | 1.56 |
Sn63Pb37 | 12.41 | 9400.0 | 4E6 | 1.50 | 1378.95 | 0.303 | 13.79 | 0.070 | 1.30 |
Table 3 Material parameters of viscoplastic Anand model of solder [26]
Material | S0 (MPa) | Q/R (1/K) | A (1/s) | ξ | h0 (MPa) | m | ? | n | a |
---|---|---|---|---|---|---|---|---|---|
Indium | 28.30 | 9369.7 | 2.33E8 | 49.97 | 0 | 0.300 | 28.30 | 0 | 1 |
Sn3.0Ag0.5Cu | 40.16 | 8400.0 | 4.61E6 | 4.60 | 3090.00 | 0.162 | 14.37 | 0.038 | 1.56 |
Sn63Pb37 | 12.41 | 9400.0 | 4E6 | 1.50 | 1378.95 | 0.303 | 13.79 | 0.070 | 1.30 |
Material | Thermal conductivity (W/(m K)) | CTE (10-6/K) | Young’s modulus (GPa) | Poisson’s ratio |
---|---|---|---|---|
Sn3.0Ag0.5Cu | 35.0 | 25.0 | 39.5 | 0.35 |
Sn63Pb37 | 35.4 | 24.5 | 26.1 | 0.36 |
Table 4 Material properties of Sn3.0Ag0.5Cu and Sn63Pb37
Material | Thermal conductivity (W/(m K)) | CTE (10-6/K) | Young’s modulus (GPa) | Poisson’s ratio |
---|---|---|---|---|
Sn3.0Ag0.5Cu | 35.0 | 25.0 | 39.5 | 0.35 |
Sn63Pb37 | 35.4 | 24.5 | 26.1 | 0.36 |
Level factor | Solder | Target thickness | Solder layer thickness | Backing plate thickness |
---|---|---|---|---|
A | B | C | D | |
Level 1 | In | 15 | 0.8 | 15 |
Level 2 | Sn3.0Ag0.5Cu | 12 | 0.7 | 12 |
Level 3 | Sn63Pb37 | 9 | 0.6 | 9 |
Table 5 Control factors and levels
Level factor | Solder | Target thickness | Solder layer thickness | Backing plate thickness |
---|---|---|---|---|
A | B | C | D | |
Level 1 | In | 15 | 0.8 | 15 |
Level 2 | Sn3.0Ag0.5Cu | 12 | 0.7 | 12 |
Level 3 | Sn63Pb37 | 9 | 0.6 | 9 |
Experiment number | Control factor and level | Quality | S/N (dB) | |||
---|---|---|---|---|---|---|
A | B | C | D | Seqv (MPa) | ||
1 | 1 | 1 | 1 | 1 | 20.2 | -?26.1 |
2 | 1 | 2 | 2 | 2 | 23.7 | -?27.5 |
3 | 1 | 3 | 3 | 3 | 28.5 | -?29.1 |
4 | 2 | 1 | 2 | 3 | 78.7 | -?37.9 |
5 | 2 | 2 | 3 | 1 | 69.0 | -?36.8 |
6 | 2 | 3 | 1 | 2 | 65.7 | -?36.4 |
7 | 3 | 1 | 3 | 2 | 63.3 | -?36.0 |
8 | 3 | 3 | 1 | 3 | 58.0 | -?35.3 |
9 | 3 | 2 | 2 | 1 | 56.3 | -?35.0 |
Table 6 Orthogonal array and simulation results
Experiment number | Control factor and level | Quality | S/N (dB) | |||
---|---|---|---|---|---|---|
A | B | C | D | Seqv (MPa) | ||
1 | 1 | 1 | 1 | 1 | 20.2 | -?26.1 |
2 | 1 | 2 | 2 | 2 | 23.7 | -?27.5 |
3 | 1 | 3 | 3 | 3 | 28.5 | -?29.1 |
4 | 2 | 1 | 2 | 3 | 78.7 | -?37.9 |
5 | 2 | 2 | 3 | 1 | 69.0 | -?36.8 |
6 | 2 | 3 | 1 | 2 | 65.7 | -?36.4 |
7 | 3 | 1 | 3 | 2 | 63.3 | -?36.0 |
8 | 3 | 3 | 1 | 3 | 58.0 | -?35.3 |
9 | 3 | 2 | 2 | 1 | 56.3 | -?35.0 |
Level factor | A | B | C | D |
---|---|---|---|---|
Level 1 | -?27.6 | -?33.3 | -?32.6 | -?32.6 |
Level 2 | -?37.0 | -?33.1 | -?33.5 | -?33.3 |
Level 3 | -?35.4 | -?33.6 | -?40.0 | -?34.1 |
Effect | 9.4 | 0.5 | 7.4 | 1.5 |
Rank | 1.0 | 4.0 | 2.0 | 3.0 |
Table 7 S/N response and rank
Level factor | A | B | C | D |
---|---|---|---|---|
Level 1 | -?27.6 | -?33.3 | -?32.6 | -?32.6 |
Level 2 | -?37.0 | -?33.1 | -?33.5 | -?33.3 |
Level 3 | -?35.4 | -?33.6 | -?40.0 | -?34.1 |
Effect | 9.4 | 0.5 | 7.4 | 1.5 |
Rank | 1.0 | 4.0 | 2.0 | 3.0 |
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