Acta Metallurgica Sinica (English Letters) ›› 2021, Vol. 34 ›› Issue (6): 861-871.DOI: 10.1007/s40195-020-01154-5
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Yan Song1,2, Hongxiang Jiang1,2, Lili Zhang1, Shixin Li1,2, Jiuzhou Zhao1,2(), Jie He1,2
Received:
2020-05-18
Revised:
2020-08-18
Accepted:
2020-08-30
Online:
2021-06-10
Published:
2021-05-31
Contact:
Jiuzhou Zhao
About author:
Jiuzhou Zhao,jzzhao@imr.ac.cnYan Song, Hongxiang Jiang, Lili Zhang, Shixin Li, Jiuzhou Zhao, Jie He. A Model Describing Solidification Microstructure Evolution in an Inoculated Aluminum Alloys[J]. Acta Metallurgica Sinica (English Letters), 2021, 34(6): 861-871.
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Fig. 4 Measured and predicted grain sizes of the inoculated Al-1.0Cu alloy vs a the additive amount of Al-5Ti-0.5C for a given HTT of 10 min at 993 K and b the HTT at 993 K for a given refiner addition lever of 0.4%. The error bars represent standard deviations
Parameter | Value |
---|---|
Diffusion coefficient of solute Cu in Al melt, DCu (m2/s) | 4.65 × 10-9 [ |
Diffusion coefficient of solute Ti in Al melt, DTi (m2/s) | 2.52 × 10-9 [ |
Interfacial energy between the TiC and liquid Al, σmTiC (J/m2) | 0.72 [ |
Interfacial energy between the α-Al and liquid Al, σmα-Al (J/m2) | 0.158 [ |
Strength of the anisotropy of the interfacial energy, ε | 0.04 [ |
Partion coefficient for Al-Cu alloys, k0,Cu | 0.14 [ |
Liquidus slope for Al-Cu alloys, ml,Cu | - 2.6 [ |
Partion coefficient for Al-Ti alloys, k0,Ti | 25.63 [ |
Liquidus slope for Al-Ti alloys, ml,Ti | 7 [ |
Gibbs-Thomson coefficient for Al-Cu alloys, $\bar{\varGamma }$(mk) | 2.4 × 10-7 [ |
Heat capacity of Al melt, CP (J/K·m3) | 2.58 × 106 [ |
Table 1 Thermo-physical parameters used in the calculations
Parameter | Value |
---|---|
Diffusion coefficient of solute Cu in Al melt, DCu (m2/s) | 4.65 × 10-9 [ |
Diffusion coefficient of solute Ti in Al melt, DTi (m2/s) | 2.52 × 10-9 [ |
Interfacial energy between the TiC and liquid Al, σmTiC (J/m2) | 0.72 [ |
Interfacial energy between the α-Al and liquid Al, σmα-Al (J/m2) | 0.158 [ |
Strength of the anisotropy of the interfacial energy, ε | 0.04 [ |
Partion coefficient for Al-Cu alloys, k0,Cu | 0.14 [ |
Liquidus slope for Al-Cu alloys, ml,Cu | - 2.6 [ |
Partion coefficient for Al-Ti alloys, k0,Ti | 25.63 [ |
Liquidus slope for Al-Ti alloys, ml,Ti | 7 [ |
Gibbs-Thomson coefficient for Al-Cu alloys, $\bar{\varGamma }$(mk) | 2.4 × 10-7 [ |
Heat capacity of Al melt, CP (J/K·m3) | 2.58 × 106 [ |
Fig. 5 Solidification microstructure evolution of the Al-1.0Cu inoculated by 0.1% Al-5Ti-0.5C. The number density (NTiC) and average radius (<?RTiC?>) of TiC as a function of time; Nall is the total number density of α-Al nuclei, Ndendrities is the number density of the α-Al nuclei with dendritic morphology, Nspherical is the number density of the spherical α-Al nuclei
Fig. 6 Radius RTiC distribution of the TiC particles in the Al-1.0Cu melt inoculated by 0.1% Al-5Ti-0.5C at different holding temperature time at 993 K
Fig. 7 Undercooling ?T of the melt and nucleation rate Iα-Al of α-Al during cooling the Al-1.0Cu melt inoculated by 0.1% Al-5Ti-0.5C. The HTT at 993 K is 10 min
Fig. 8 Simulated solidification microstructure evolution of the Al-1.0Cu inoculated by 0.1% Al-5Ti-0.5C. a fs?=?0.1%, b fs?=?0.8%, c fs?=?22.0%, d fs?=?90.0%. The size of computational domain is 600 μm?×?600 μm?×?600 μm
Fig. 9 Solidification microstructures of the Al-1.0Cu with 10 min HTT at 993 K. The additive amount of Al-5Ti-0.5C is a, d 0.05%, b, e 0.2% and c, f 1.2%. a-c are the simulation results, d-f are the experimental results
Fig. 10 Solidification microstructures of the Al-1.0Cu inoculated by 0.4% Al-5Ti-0.5C. The HTT at 993 K is a, d 20 min, b, e 40 min, and c, f 60 min. a-c are the simulation results, d-f are the experimental results
Fig. 11 Grain size vs the HTT for the Al-4.5Cu inoculated by Al-24Ti-6C solidified at the cooling rate of 100 K/s. The experimental results are from Ref. [38]
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