Effect of Deposition Potential on Synthesis, Structural, Morphological and Photoconductivity Response of Cu2O Thin Films by Electrodeposition Technique

doi:10.1007/s40195-019-00876-5

Abstract

Abstract:

The present work describes the effect of deposition potentials on structural, morphological, optical, electrical and photoconductivity responses of cuprous oxide (Cu₂O) thin films deposited on fluorine-doped tin oxide glass substrate by employing electrodeposition technique. X-ray diffraction patterns reveal that the deposited films have a cubic structure grown along the preferential (111) growth orientation and crystallinity of the film deposited at -0.4 V is improved compared to the films deposited at -0.2, -0.3 and -0.5 V. Scanning electron microscopy displays that surface morphology of Cu₂O film has a well-defined three-sided pyramid-shaped grains which are uniformly distributed over the surface of the substrates and are significantly changed as a function of deposition potential. Raman and photoluminescence spectra manifest that the film deposited at -0.4 V has a good crystal quality with higher acceptor concentration compared to other films. UV-visible analysis illustrates that the absorption of Cu₂O thin film deposited at -0.4 V is notably higher compared to other films and the band gap of Cu₂O thin films decreases from 2.1 to 2.04 eV with an increase in deposition potential from -0.2 to -0.5 V. The frequency-temperature dependence of impedance analysis shows that the film deposited at -0.4 V has a high conductivity. I-V measurements elucidate that the film deposited at -0.4 V exhibits a good photoconductivity response compared to films deposited in other deposition potentials.

Key words: Electrodeposition, Cu₂O thin films, Photoconductivity response, I-V measurement

K. P. Ganesan, N. Anandhan, T. Marimuthu, R. Panneerselvam, A. Amali Roselin. Effect of Deposition Potential on Synthesis, Structural, Morphological and Photoconductivity Response of Cu₂O Thin Films by Electrodeposition Technique[J]. Acta Metallurgica Sinica (English Letters), 2019, 32(9): 1065-1074.

Figures/Tables 9

Fig. 1 X-ray diffraction patterns of Cu2O thin films deposited at different deposition potentials: a -0.2 V, b -0.3 V, c -0.4 V, d -0.5 V The crystallite size of the films deposited at different deposition potentials was estimated by using Scherrer formula (Eq. 1) and is summarized in Table 1 [27].

Table 1 Microstructural parameters of the Cu2O thin films

Potential (V)	Crystallite size, D (nm)	Dislocation density, δ×10¹⁴ (lines m^-2)	Micro-strain, ε (×10^-3 lines^-2 m^-4)	Stacking fault probability, α
-0.2	44.11	5.13	0.754	6.86
-0.3	31.76	9.91	0.792	3.80
-0.4	35.00	8.16	0.669	1.50
-0.5	28.37	12.42	0.720	0.60

Fig. 2 SEM micrograph of Cu2O thin films deposited at different deposition potentials: a, b -0.2 V, c, d -0.3 V, e, f -0.4 V, g, h -0.5 V

Fig. 3 Raman spectra of Cu2O thin films deposited at different deposition potentials: a -0.2 V b -0.3 V, c -0.4 V, d -0.5 V

Fig. 4 PL spectra of Cu2O thin films deposited at different deposition potentials: a -0.2 V, b -0.3 V, c -0.4 V, d -0.5 V

Fig. 5 Absorption spectra of Cu2O thin films deposited at different deposition potentials: a -0.2 V, b -0.3 V, c -0.4 V, d -0.5 V

Fig. 6 Tauc’s plots of Cu2O thin films deposited at different deposition potential: a -0.2 V, b -0.3 V, c -0.4 V, d -0.5 V

Fig. 7 Temperature-dependent ac electrical conductivity of Cu2O thin films deposited at different deposited potentials: a -0.2 V, b -0.3 V, c -0.4 V, d -0.5 V, e ac electrical conductivity carried out at 80 °C

Fig. 8 I-V characteristic curves recorded under the dark and illumination conditions for Cu2O thin films deposited at different deposition potentials: a -0.2 V, b -0.3 V, c -0.4 V, d-0.5 V and eI-V characteristic curves under light luminescence

References

[1]	G.P. Pollack, D. Trivich, J. Appl.Phys. 46, 163(1975)
[2]	M. Izaki, S. Sasaki, F. Binti Mohamed, T. Shinagawa, Thin Solid Films 520, 1779 (2011)
[3]	R.G. Delatorre, M.L. Munford, R. Zandonay, V.C. Zolden, Appl. Phys. Lett. 88, 233504(2006)
[4]	Mittiga, E. Salza, F. Sarto, M. Tucci, R. Vasanthi,Appl. Phys. Lett. 88, 163502(2006)
[5]	G. Yang, A. Chen, M. Fu, H. Long, P. Lu,J. Appl.Phys.A 104, 171 (2010)
[6]	S. Song, R. RaO, H. Yang, A. Zhang, J. Phys.Chem.C 114, 13998 (2010)
[7]	C. Wang, B. Geng, J. Liu, Y. Zhao, Cryst. Eng. Commun. 13, 697(2011)
[8]	Ahmed, N.S. Gaibhiyle, S. Kurian, J. Solid State Chem. 183, 2248(2010)
[9]	V.F. Drobny, D.L. Pulfrey, Thin Solid Films 61, 89 (1979)
[10]	D. Osorio-Rivera, G. Torred-Delgado, J. Marquez-Marin, J. Mater.Sci.: Mater.Electron. 29, 851(2018)
[11]	D.S.C. Halin, I.A. Talib, A.R. Daud, Int.J.Photoenergy 2014, 1(2014)
[12]	Chen, H. Long, X. Li, Y. Li, G. Yang, P. Lu, Vaccum 83, 927 (2009)
[13]	G.F. Pan, S.B. Fan, J. Liang, Y.X. Liu, RSC Adv. 5, 42477(2015)
[14]	M.J. Chen, C.Y. Wu, Y.M. Kuo, J. Appl.Phys.A 108, 133 (2012)
[15]	K.P. Ganesan, N. Anandhan, V. Dharuman, P. Sami, R. Panneerselvam, T. Marimuthu, Results Phys. 7, 82(2017)
[16]	T. Marimuthu, N. Anandhan, R. Thangamuthu, S. Surya, J. Mater.Sci.: Mater.Electron. 29, 12830(2018)
[17]	T. Marimuthu, N. Anandhan, R. Thangamuthu, J. Mater.Sci. 53, 12441(2018)
[18]	T. Marimuthu, N. Anandhan, R. Thangamuthu, Appl. Surf. Sci. 428, 385(2018)
[19]	X. Jiang, M. Zhan, S. Shi, G. He, X. Song, Z. Sun, Nanoscale Res.Lett. 9, 219(2014)
[20]	S. Laioudi, A.Y. Bioud, A. Azizi, G. Schmerber, Semicond. Sci. Technol. 28, 15005(2013)
[21]	S. Haller, J. Jung, J. Rousset, D. Lincot, Electrochim. Acta 82, 402 (2012)
[22]	J. Han, J. Chang, R. Wei, Int.J. Hydrogen Energy. 43, 13764 (2018)
[23]	M. Zhao, Y. Jiang, J. Lv, J. Mater Sci: Mater.Electrons,27, 1799 (2016)
[24]	D. Mohra, M. Benhaliliba, M. Serin, J.Semicond. 37, 103001(2016)
[25]	X. Jiang, M. Zhang, S. Shi, J. Electrochem.Soc. 161, D640(2014)
[26]	D. Yan, S. Li, M. Hu, S. Liu, Y. Zhu, M. CaO, Sens. Actuators B:Chem. 211, 318(2015)
[27]	T. Marimuthu, N. Anandhan, R. Thangamuthu, M. Mummoorthi, S. Rajendran, G. Ravi, Mater.Res.Express.2, 015502 (2016)
[28]	L. Wan, AIP Conf Proc. 1995, 020017(2018)
[29]	H.P. Klug, L.E. Alexander, X-ray Diffr. Proced. Polycryst. Amorph. Mater 992, 1 (1974)
[30]	T. Mahalingam, V. Dhanasekaran, K. Sundraram, A. Kathalingam, J.K. Rhee, J.Ionics.18, 299 (2012)
[31]	T. Marimuthu, N. Anandhan, R. Thangamuthu, S. Surya, Superlattices Microstruct. 98, 332(2016)
[32]	S.B. Qadri, E.F. Skelton, D. Hsu, A.D. Dinsmore, J. Yang, H.F. Gray, B.R. Rata, Phys. Rev. B 60, 9191 (1999)
[33]	M. Abdelfatah, J. Ledig, J. Electrochem.Soc. 5, 183(2016)
[34]	S. Chatterjee, S.K. Saha, A.J. Pal, Sol. Energy Mater. Sol. Cells 147, 17 (2016)
[35]	W. Septina, S. Ikeda, M. Alam Khan, Electrochim. Acta.56, 4882 (2011)
[36]	S. Wu, Z. Yin, Q. He, G. Lu, X. Zhou, H. Zhang, J. Mater.Chem. 21, 3467(2011)
[37]	S. Eisemann, A. Kronenberger, A. Laufer, J. Bieber, G. Hass, S. Lautenschlager, G. Homm, P.J. Klar, B.K. Meyer, Phys. Stat.Solid A. 209, 513 (2012)
[38]	M. Abdelfatah, J. Ledig, A. El-Share, A. Sharafeev, J. Solid State.Sci. Technol. 5, Q183(2016)
[39]	M.C. Huang, T. Hai Wang, W.S. Chang, J.C. Lin, C.C. Wu, Appl. Surf. Sci. 301, 369(2014)
[40]	Y. Liu, C. Liu, R. Mu, H. Yang, C. Shao, J.Y. Zhang, Y.M. Lu, D. Shen, X.W. Fan, Semicond. Sci. Technol. 20, 44(2005)
[41]	Z. Min, L.V. Yao, J. Guo, S. Yue, C. Li, H. Gang, J. Mater.Sci.Mater. Electron. 25, 1799(2015)
[42]	T. Marimuthu, N. Anandhan, R. Thangamuthu, M. Mummoorthi, G. Ravi, J. Alloys Compd. 677, 211(2016)
[43]	Y. Akaltun, M. Aliyildirim, A. Stes, M. Yidirim, Optics Commun. 284, 2307(2011)
[44]	T. Acharya, R.N.P. Chouhary, Mater. Chem.Phys.177, 131(2016)
[45]	Latif, T.B. Alwan, A.H. Al-Dujaili, Nanosci. Nanotechnolol. 2, 190(2012)
[46]	Rawat, H.K. Mahavar, A. Tanwar, Bull. Mater.Sci. 37, 273(2014)
[47]	T. Logu, R. Raliya, K. Sethuraman, Cryst. Eng. Commun. 1039, 1(2017)

Effect of Deposition Potential on Synthesis, Structural, Morphological and Photoconductivity Response of Cu₂O Thin Films by Electrodeposition Technique

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