Machining Characteristics in Cryogenic Grinding of SiCp/Al Composites

doi:10.1007/s40195-014-0126-3

Abstract

Abstract:

In this study, liquid nitrogen was applied to grind SiCp/Al composites with high volume fraction and large SiC particle at different levels of cutting conditions, and the effects of grinding depth and speed on grinding force, surface morphology, and surface roughness were investigated. At the same time, the effect of cryogenic cooling was also compared with that of conventional wet grinding. The experimental results indicated that cryogenic cooling is effective in enhancing supporting function of Al matrix to the SiC particles and improving surface quality. Additionally, the brittle fracture of SiC particles was suppressed and some ductile streaks on SiC particle could be observed.

Key words: SiCp/Al composites, Grinding, Cryogenic machining, Surface quality

Zhou Li, Huang Shutao, Yu Xiaolin. Machining Characteristics in Cryogenic Grinding of SiCp/Al Composites[J]. Acta Metallurgica Sinica (English Letters), 2014, 27(5): 869-874.

Figures/Tables 8

Fig. 1 Micrographs of SiCp/Al composites used for experiments

Fig. 2 Schematic illustration of the experimental setup using liquid nitrogen

Table 1 Experimental facility, material, and grinding parameters and conditions

Grinding machine	MG7132
Workpiece material	SiCp/Al composites, dimension of 59 mm &#X000D7; 47 mm &#X000D7; 8 mm
Grinding method	Surface up grinding
Grinding wheel	Resin-bonded diamond grinding wheel, grit size of 28 μm, ϕ300 mm &#X000D7; 32 mm
Wheel speed	1,500 r/min
Table speed	3.3, 7.5, 9.7, 10.9, and 19 m/min
Grinding depth	1, 2, 3, 4, and 5 μm
Cooling	Wet grinding, water-based coolant; liquid nitrogen
Dressing method	Single point diamond

Fig. 3 Grinding forces versus depth of cut under wet condition: a normal grinding force; b tangential grinding force

Fig. 4 Grinding forces versus depth of cut under cryogenic condition: a normal grinding force; b tangential grinding force

Fig. 5 SEM micrographs of ground surface of SiCp/Al composites under wet grinding condition with different magnifications of &#X000D7;200 a, &#X000D7;1,000 b &#X000D7;5,000 c

Fig. 6 SEM micrographs of ground surface of SiCp/Al composites under cryogenic condition with different magnifications of &#X000D7;200 a,&#X000D7;1,000 b &#X000D7;5,000 c

Fig. 7 Surface roughness versus depth of cut under wet condition a cryogenic condition b

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