Precipitation Behavior and Strengthening and Toughening Mechanisms of Pre-fabricated Strong Basal Texture AZ80 + 0.4%Ce Alloy Under Room-Temperature Pre-deformation Coupled with Dual-Stage Aging Conditions

doi:10.1007/s40195-025-01856-8

Abstract

Abstract:

This work presents the modified precipitation behavior of the β phase in a Mg-8.0Al-0.5Zn-0.2Mn-0.4Ce alloy (wt%, designated as AZ80 + 0.4%Ce), which has been subjected to room-temperature pre-compression and a subsequent dual-stage aging treatment, thereby imparting it with the pronounced basal texture. It was found that the synergistic application of pre-compression and dual-stage aging protocol markedly accelerates the age-hardening response and architecture of the continuous precipitates (CPs) in the present AZ80 + 0.4%Ce alloy. Consequently, this alloy achieves an exceptional balance between strength and ductility, boasting a yield strength of approximately 229.0 MPa alongside an elongation of around 7.0%. A series of microstructural characterizations reveal that high-density intragranular dislocations introduced by pre-compression serve as catalysts for the preferential formation of CPs over the discontinuous precipitates, effectively suppressing the latter. Notably, this also facilitates static recrystallization, which refines the grain structure and alleviates the residual stresses induced by deformation, further enhancing the mechanical properties. This research contributes a novel perspective to the thermomechanical processing design of precipitation-hardened lightweight alloys, offering a pathway to optimize their performance through tailored thermomechanical strategies.

Key words: AZ80 magnesium alloy, Dislocations, Dual-stage aging, Discontinuous precipitation, Strengthening and toughening mechanisms

Yuxuan Li, Xi Zhao, Shuchang Li, Yihan Gao, Rui Guo. Precipitation Behavior and Strengthening and Toughening Mechanisms of Pre-fabricated Strong Basal Texture AZ80 + 0.4%Ce Alloy Under Room-Temperature Pre-deformation Coupled with Dual-Stage Aging Conditions[J]. Acta Metallurgica Sinica (English Letters), 2025, 38(7): 1127-1144.

Figures/Tables 15

Table 1 Chemical composition of the cast AZ80 + 0.4%Ce (wt%) [17]

Al	Zn	Mn	Si	Fe	Ni	Cu	Ce	Mg
8.35	0.62	0.17	< 0.1	< 0.005	< 0.005	< 0.05	0.4	Bal.

Fig. 1 Schematic of the forming process and sampling

Table 2 Heat treatment schedule for the extruded AZ80 + 0.4%Ce alloy

Design	Heat treatment schedule	Time
ST(WQ)	415 ℃	1 h
STA	175 ℃	0-48 h (/6 h)
PCA	175 ℃	0-48 h (/6 h)
STB	120 ℃/8 h + 175 ℃	0-48 h (/6 h)
PCB	120 ℃/8 h + 175 ℃	0-48 h (/6 h)

Fig. 2 Microstructural features of ST and PC materials: a and b IPF map and (0001) pole figure of ST material, c and d IPF map and (0001) pole figure of PC material

Fig. 3 KAM maps and GOS maps: a, c ST materials and b, d PC materials

Fig. 4 Variation of hardness with aging time for ST and PC material: a single-stage aging and b second stage of dual-stage aging

Fig. 5 Engineering tensile stress-strain curves of alloys in different conditions

Table 3 Tensile mechanical properties of alloys in different conditions

	ST	PC	STA	STB	PCA	PCB
TYS (MPa)	79.6	154.7	159.3	157.9	162.3	229.0
UTS (MPa)	210.7	265.7	263.0	269.0	277.0	359.1
EL (%)	14.3	8.8	6.7	6.7	5.6	7.0

Fig. 6 Low-magnification SEM images of the peak-age precipitation behavior of ST and PC materials: a STA material, b PCA material, c STB material, and d PCB material

Fig. 7 a High-magnification SEM images of ST and PC materials after single-stage aging at 175 °C for 6 h, 18 h, and 36 h; b high-magnification SEM images of ST and PC materials after dual-stage aging at 120 °C for 8 h + 175 °C for 6 h, 18 h, and 36 h

Fig. 8 High-magnification SEM images of ST and PC materials after the first-stage aging treatment at 120 °C for 8 h: a ST material and b PC material

Fig. 9 Movement behavior of solute atoms within ST and PC materials during the first-stage aging process

Fig. 10 Microstructural characteristics of peak-aged materials: IPF maps a, d, g, j, KAM maps b, e, h, k, and (0001) pole figures c, f, i, l of STA material a, b, c, STB material d, e, f, PCA material g, h, i, and PCB material j, k, l

Fig. 11 SF distributions of basal < a >, prismatic < a >, pyramidal < a >, and pyramidal < c + a > slip systems during tensile deformation of STA, STB, PCA, and PCB materials along the RD direction

Fig. 12 Schematic of the hindrance effect of precipitates on dislocation slip in different aged alloys: a STA, STB, and PCA materials; b PCB material

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