Thermal Deformation Behavior and Processing Map of a Novel CrFeNiSi0.15 Medium Entropy Alloy

doi:10.1007/s40195-023-01606-8

Abstract

Abstract:

The thermal deformation behavior of a novel CrFeNiSi_0.15 medium entropy alloy (MEA) was studied via isothermal compression experiments, with the processing parameter range of 900-1200 °C and 0.001-1 s⁻¹. According to experimental data, the modified constitutive equation had been obtained, which precisely predicted the flow behavior of CrFeNiSi_0.15 MEA during thermal deformation. At the same time, the processing map was established on the basis of the dynamic material model (DMM) theory. According to the map, the optimal processing parameters were determined at 1130-1200 °C/0.06-1 s⁻¹, under which the power dissipation efficiency could reach above 34%. The peak efficiency was above 38%, which occurred at 1200 °C/1 s⁻¹. In such parameter, complete dynamic recrystallization (DRX) also occurred. The flow instability of CrFeNiSi_0.15 MEA was estimated to occur at 900-985 °C/0.12-1 s⁻¹, which was shown as grain boundaries cracking. Furthermore, both the continuous DRX (CDRX) and discontinuous DRX (DDRX) occurred simultaneously during thermal deformation. Meanwhile, some twins were also newly formed during DRX process, most of which were primary twins. The occurrence of twinning was beneficial to promote the development of DRX behavior.

Key words: Medium entropy alloys, Thermal deformation behavior, Constitutive model, Processing maps

Hongbin Zhang, Kang Chen, Zhongwei Wang, Haiping Zhou, Chengcheng Shi, Shengxue Qin, Jie Liu, Tingjun Lv, Jian Xu. Thermal Deformation Behavior and Processing Map of a Novel CrFeNiSi_0.15 Medium Entropy Alloy[J]. Acta Metallurgica Sinica (English Letters), 2023, 36(11): 1870-1882.

Figures/Tables 13

Table 1 Chemical element composition of CrFeNiSi0.15 alloy (at.%)

Alloy	Cr	Fe	Ni	Si
CrFeNiSi_0.15	32.06	31.93	31.30	4.71

Fig. 1 a X-ray diffraction patterns and b OM of CrFeNiSi0.15 MEA

Fig. 2 True stress-strain curves of CrFeNiSi0.15 MEA at different parameters: a 900 °C, b 1000 °C, c 1100 °C, d 1200 °C

Fig. 3 Linear relationships of a lnσ-ln $\dot{\varepsilon }$, b σ-ln $\dot{\varepsilon }$, c ln[sinh(σα)]-ln $\dot{\varepsilon }$, d 1000/T-ln[sinh(σα)]

Fig. 4 Correlation between peak stresses and Zener-Hollomon parameters

Fig. 5 Relationship between material constants and true strain of CrFeNiSi0.15 MEA: a ε-α, b ε-n, c ε-Q, d ε-lnA

Fig. 6 Experimental and predicted flow stress values of CrFeNiSi0.15 MEA under the tested conditions: a 900 °C, b 1000 °C, c 1100 °C, d 1200 °C

Fig. 7 Relationships between lg $\dot{\varepsilon }$ and lgσ by polynomial fit

Fig. 8 Thermal processing map of CrFeNiSi0.15 MEA

Fig. 9 Microstructures of CrFeNiSi0.15 MEA deformed under: a 900 °C/1 s−1; b 1000 °C/1 s−1; c 1100 °C/1 s−1; d 1200 °C/1 s−1; e 1200 °C/0.1 s−1; f 1200 °C/0.01 s−1; g 1200 °C/0.001 s−1

Fig. 10 OM maps of CrFeNiSi0.15 MEA deformed under 900 °C/1 s−1

Fig. 11 OIM maps of CrFeNiSi0.15 MEA deformed under: a 900 °C/1 s−1, b 1000 °C/1 s−1, c 1100 °C/1 s−1, d 1200 °C/1 s−1, e 1200 °C/0.1 s−1, f 1200 °C/0.01 s−1, g 1200 °C/0.001 s−1

Fig. 12 a TEM image of CrFeNiSi0.15 MEA, b SADP of the twin

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