A Novel Method for Achieving Gradient Microstructure in a Cu-Al Alloy: Surface Spinning Strengthening (3S)

doi:10.1007/s40195-017-0551-1

Abstract

Abstract:

A new designed surface strengthening method, surface spinning strengthening (3S), was applied to achieve gradient microstructure in the surface layer of a Cu-11 at.%Al alloy. According to the level of grain refinement, the gradient microstructure can be divided into four zones, including nanoscale grain zone, ultra-fine grain zone, fine grain zone and coarse grain zone from the surface to the matrix. Meanwhile, a plenty of grain boundaries and twin boundaries were introduced to inhibit the dislocation motion in the surface layer during the plastic deformation process. Consequently, the hardened layer with a microhardness gradient and high residual compressive stress was produced on the samples, and the yield strength of the Cu-11 at.%Al alloy was effectively improved after 3S processing due to the strengthening effect caused by the gradient microstructure.

Key words: Cu-Al alloy, Surface spinning strengthening (3S), Strength, Microhardness, Gradient microstructure

Chuan-Xi Ren, Qiang Wang, Zhen-Jun Zhang, Yan-Kun Zhu, Zhe-Feng Zhang. A Novel Method for Achieving Gradient Microstructure in a Cu-Al Alloy: Surface Spinning Strengthening (3S)[J]. Acta Metallurgica Sinica (English Letters), 2017, 30(3): 212-217.

Figures/Tables 4

Fig. 1 a Schematic illustration of the surface spinning strengthening (3S) setup. 3S-induced gradient microstructures in the surface layer of Cu-11Al-200 sample b and Cu-11Al-400 sample c, including the orientation distribution maps and the pole figures

Fig. 2 TEM micrographs of Cu-11Al alloy: a Cu-11Al-200 sample in the fine grain zone, b Cu-11Al-400 sample in the fine grain zone, c Cu-11Al-200 sample in the nanoscale grain zone, d Cu-11Al-400 sample in the nanoscale grain zone

Fig. 3 a Variation of the gradient mechanical property of Cu-11Al alloy with the depth from the surface, b tensile engineering stress-strain curves of Cu-11Al alloy with different 3S processing feed amounts, c residual stress profiles following different 3S processing depths on Cu-11Al alloy

Fig. 4 Schematic illustration of the variation of the microhardness with the depth from the surface, and the gradient microstructure with grain refinement in the surface layer of Cu-11Al alloy processed by the 3S method

References

[1]	E.P. Busso, S.D. Antolovich, Acta Mater. 107, 484(2016)
[2]	R.O. Ritchie, Int. J. Fract. 100, 55(1999)
[3]	A. Pineau, A. Amine Benzerga, T. Pardoen, Acta Mater. 107,508(2016)
[4]	N. Tsuji, S. Tanaka, T. Takasugi, Mater. Sci. Eng. A 488, 139(2008)
[5]	H.W. Huang, Z.B. Wang, J. Lu, K. Lu, Acta Mater. 87, 150(2015)
[6]	P.J. Withers, Rep. Prog. Phys. 70, 2211(2007)
[7]	T.H. Fang, W.L. Li, N.R. Tao, K. Lu, Science 331, 1587 (2011)
[8]	T. Roland, D. Retraint, K. Lu, J. Lu, Scr. Mater. 54, 1949 (2006)
[9]	V. Llaneza, F.J. Belzunce, Appl. Surf. Sci. 356, 475(2015)
[10]	H.B. Wang, G.L. Song, G.Y. Tang, J. Alloys Compd. 681, 146(2016)
[11]	N. Tsuji, S. Tanaka, T. Takasugi, Surf. Coat. Technol. 203, 1400(2009)
[12]	M.A.S. Int. J. Fatigue 24, 877 (2002)
[13]	C. Yuan, R.D. Fu, F.C. Zhang, X.Y. Zhang, F.C. Liu, Mater. Sci.Eng. A 565, 27 (2013)
[14]	Y.M. Lin, J. Lu, L.P. Wang, T. Xu, Q.J. Xue, Acta Mater. 54,5599(2006)
[15]	X.C. Liu, H.W. Zhang, K. Lu, Science 342, 337 (2013)
[16]	K.S. Kumar, H. Van Swygenhoven, S. Suresh, Acta Mater. 51,5743(2003)
[17]	R.Z. Valiev, Nat. Mater. 3, 511(2004)
[18]	K. Lu, J. Lu, Mater. Sci. Eng. A 375, 38 (2004)
[19]	T. Roland, D. Retraint, K. Lu, J. Lu, Mater. Sci. Eng. A 445, 281(2007)
[20]	J. Hirsch, K. Lucke, M. Hatherly, Acta Metall. 36, 2905(1988)
[21]	J.W. Christian, S. Mahajan, Prog. Mater. Sci. 39, 1(1995)
[22]	X.H. An, Q.Y. Lin, S.D. Wu, Z.F. Zhang, R.B. Figueiredo, T.G.Langdon, Philos. Mag. 91, 3307(2011)
[23]	R. Liu, Z.J. Zhang, Z.F. Zhang, Mater. Sci. Eng. A 666, 123
[23]	(2016)
[24]	X.H. An, Q.Y. Lin, S.D. Wu, Z.F. Zhang, R.B. Figueiredo, N.Gao, T.G. Langdon, Scr. Mater. 64, 954(2011)
[25]	C. Ye, A. Telang, A.S. Gill, S. Suslov, Y. Idell, K. Zweiacker,J.M.K. Mater. Sci. Eng. A 613, 274 (2014)
[26]	M.A. Meyers, A. Mishra, D.J. Benson, Prog. Mater Sci. 51, 427(2006)
[27]	G.Z. Voyiadjis, B. Deliktas, Int. J. Plast. 25, 1997 (2009)
[28]	D. Kiener, A.M. Minor, Acta Mater. 59, 1328(2011)
[29]	F. Macionczyk, W. Bruckner, J. Appl. Phys. 86, 4922(1999)
[30]	A.H. Heuer, F. Ernst, H. Kahn, A. Avishai, G.M. Michal, D.J.Pitchure, R.E. Ricker, Scr. Mater. 56, 1067(2007)
[31]	K. Lu, L. Lu, S. Suresh, Science 324, 349 (2009)
[32]	V. Yamakov, D. Wolf, S.R. Phillpot, A.K. Mukherjee, H.Gleiter, Nat. Mater. 1, 45(2002)
[33]	J. Wang, X. Zhang, MRS Bull. 41, 274(2016)
[34]	M.L. Kronberg, Acta Metall. 5, 507(1957)
[35]	N. Tsuji, Y. Saito, H. Utsunomiya, S. Tanigawa, Scr. Mater. 40,795(1999)
[36]	Y.Z. Tian, J.J. Li, P. Zhang, S.D. Wu, Z.F. Zhang, M. Kawasaki,T.G. Langdon, Acta Mater. 60, 269(2012)
[37]	L. Bardella, A. Panteghini, J. Mech. Phys. Solids 78, 467 (2015)