Abstract: The paper deals with different plastic deformation behavior of electroformed copper liner of shaped charge,depormed at high strain rate(about 1×10^7s^-1) and normal strain rate (4×10^-4s^-1).The crystallographic orientation distribution of grains in recovered slugs which had undergone high-strain-rate plastic deformation during ex-plosive detonation was investigated by electron backscattering Kikuchi pattern tech-nique.Cellualar structures formed by tangled disocations and sub-grain boundaries consisting of dislocation arrays were detected in the recovered slugs.Some twins and slip dislocations were observed in specimen deformed at normal strain rate.It was found that dynamic recovery and recrystallization take place during high-strain-rate deformation due to the temperature rising,whereas the conventional slip mechanism operates during deformation at normal strain rate.

Key words: electroformation, electron backscattering kikuchi pattern,