THE INFLUENCES OF SOLUTION PH AND CURRENT DENSITY ON COERCIVITY OF ELECTROPLATING CoNdNiMnP PERMANENT MAGNETIC ALLOY FTLM ARRAYS

Acta Metallurgica Sinica (English Letters) ›› 2004, Vol. 17 ›› Issue (5): 677-681 .

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THE INFLUENCES OF SOLUTION PH AND CURRENT DENSITY ON COERCIVITY OF ELECTROPLATING CoNdNiMnP PERMANENT MAGNETIC ALLOY FTLM ARRAYS

H.C.Jiang, W.L.Zhang, J.P.Zhang, W.X.Zhang, B.Peng, S.Q.Yang

School of Microelectronics and Solid Electronics,University of Electronic Science and Technology of China,Ghengdu610054,Ghina

Received:1900-01-01 Revised:1900-01-01 Online:2004-10-25 Published:2009-10-10
Contact: H.C.Jiang

Abstract

Abstract: The influences of plating bath solution PH and current density on coercivity of electroplating CoNdNiMnP permanent magnetic film arrays were studied. The experiment results show that both for solution PH and current density there were the best depositing parameters. Too high and too low plating bath solution PH or current density both result in decreasing of the film array coercivity. When solution PH is 3.5 and current density is 5mA/cm^2, the prepared film array coercivity can reach the maximum.

Key words: solution PH, current density, electroplating

H.C.Jiang, W.L.Zhang, J.P.Zhang, W.X.Zhang, B.Peng, S.Q.Yang. THE INFLUENCES OF SOLUTION PH AND CURRENT DENSITY ON COERCIVITY OF ELECTROPLATING CoNdNiMnP PERMANENT MAGNETIC ALLOY FTLM ARRAYS[J]. Acta Metallurgica Sinica (English Letters), 2004, 17(5): 677-681 .

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THE INFLUENCES OF SOLUTION PH AND CURRENT DENSITY ON COERCIVITY OF ELECTROPLATING CoNdNiMnP PERMANENT MAGNETIC ALLOY FTLM ARRAYS

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