TENSILE AND ADHESIVE STRENGTHS OF FINE TiN FILM ON Ti SUBSTRATE

Acta Metallurgica Sinica (English Letters) ›› 1993, Vol. 6 ›› Issue (8): 126-129.

• Research paper • Previous Articles Next Articles

TENSILE AND ADHESIVE STRENGTHS OF FINE TiN FILM ON Ti SUBSTRATE

Received:1993-08-11 Revised:1993-08-11 Online:1993-08-11 Published:2009-10-10

Abstract

Abstract: The cantilever bending test,particularly monitored by an acoustic emission technique, was adopted to measure the tensile and interfacial adhesive strengths of the HCD ion plated fine TiN film on pure Ti substrate.The behaviors of film damaging were found to be characterized by:an internal tensile stress which exceeded its tensile strength for TiN facing upward,and a shearing stress along film substrate interface which exceeded its adhesive strength for TiN facing downward.The measured tensile and adhcsive strengths are 603 and 242 MPa respectively.

Key words: tensile strength, adhesive strength, TiN film, Ti

LIU Changqing;LI Meishuan;JIN Zhujing;WU Weitao Corrosion Science Laboratory,Institute of Corrosion and Protection of Metals,Academia Sinica,Shenyang,China research assistant,Institute of Corrosion and Protection of Metals,Academia Sinica,Shenyang 110015,China. TENSILE AND ADHESIVE STRENGTHS OF FINE TiN FILM ON Ti SUBSTRATE[J]. Acta Metallurgica Sinica (English Letters), 1993, 6(8): 126-129.

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TENSILE AND ADHESIVE STRENGTHS OF FINE TiN FILM ON Ti SUBSTRATE

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