Acta Metallurgica Sinica (English Letters) ›› 1993, Vol. 6 ›› Issue (8): 81-86.

• Research paper •     Next Articles

INTERACTION BETWEEN Cu AND LIQUID Sn(II)——SEM OBSERVATION OF INTERMETALLIC GROWTH

ZHANG Qiyun;LIU Shuqi;XU Yaping Peking University,Beijing,China professor,Department of Chemistry,Peking University,Beijing,100871,China   

  • Received:1993-08-11 Revised:1993-08-11 Online:1993-08-11 Published:2009-10-10

Abstract: The features of Cu_6Sn_5 growing slowly at lower temperature and growing rapidly up over 350℃,and or Cu_3Sn growing at higher temperatures,bave been detailedly observed under SEM.The increase of Pb content seems to inhibit sequentially the growth of Cu_6Sn_5 in Pb-Sn alloy.

Key words: Cu, liquid Sn, Cu_6Sn_5, Cu_3Sn, lead wire solderability