Acta Metallurgica Sinica (English Letters) ›› 1996, Vol. 9 ›› Issue (4): 240-246.

• Research paper • Previous Articles     Next Articles

CALCULATION OF THREE-DIMENSIONAL SOLDER JOINT FORMATION IN MICROELECTRONIC SURFACE MOUNT TECHNOLOGY

G.Z. Wang,C.Q.Wang and Y.Y Qian (National Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology,Harbin 150001, China Manuscript received 21 September 1995)   

  • Received:1996-08-25 Revised:1996-08-25 Online:1996-08-25 Published:2009-10-10

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Abstract: A finite element analysis for calculating three-dimensional(3-D) solder joint shape between chip component and substrate pad was carried out, and the effects of solder volume and pad extension beyond the edge of component on solder joint shapes were investigated. The resonable design ranges of solder volume and pad extension have been put forward.

Key words: surface mount technology, chip component, solder joint shape

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