Acta Metallurgica Sinica (English Letters) ›› 1996, Vol. 9 ›› Issue (6): 485-488.

• Research paper • Previous Articles     Next Articles

DEPOSITION OF c-BN FILMS AND ADHESION IMPROVEMENT

S.R. Lee; E.S.Byon and Y.-W. Seo 1)Korea Institnte of Machinery and Materials, Changwon 641-010, Korea 2)V & P International Co., Ltd, 705-9, Gozandong, Inchon 405-310, Korea Manuscript received 26 August 1996)   

  • Received:1996-12-25 Revised:1996-12-25 Online:1996-12-25 Published:2009-10-10

Abstract: Cubic boron nitride (c-BN) films were successfully grown on Si(100)substrates by a helicon wave plasma-assisted chemical vapor deposition technique.The lower limits of rf substrated bias voltage and plasma density for formation of a single phase c-BN film were 350V and 4.5×10~(10) cm~(3),respectively. The grown c-BN films demonstrated a poor adhesion to the substrates. A postannealing treatment at 800℃ C in N_2 atmosphere was found very effective in relieving the compressive stress in the films which were thereby stabilized to improve the adhesion.

Key words: cubic boron nitride, helicon wave plasma, chemical vapor depo sition, compressive stress