Acta Metallurgica Sinica (English Letters) ›› 2011, Vol. 24 ›› Issue (6): 466-472.DOI: 10.11890/1006-7191-116-466

• 研究论文 • 上一篇    下一篇

Electrochemical behavior of Copper in the (NaCl-KCl-CuCl) molten salt

张快1,李运刚2   

  1. 1. 河北省唐山市河北理工大学08研1钢铁冶金
    2.
  • 收稿日期:2011-05-17 修回日期:2011-07-28 出版日期:2011-12-25 发布日期:2011-12-22
  • 通讯作者: 张快

Electrochemical behavior of Cu in the (NaCl-KCl-CuCl) molten salt

Yungang LI1, Jie LI2, Kuai ZHANG1,3, Limin LIU1   

  1. 1. College of Metallurgy & Energy, Hebei United University, Tangshan 063009, China
    2. Key Laboratory of Metastable Materials Science & Technology, Yanshan University, Qinhuangdao 066004,China
    3. Qinggong College, Hebei United University, Tangshan 063009, China
  • Received:2011-05-17 Revised:2011-07-28 Online:2011-12-25 Published:2011-12-22
  • Contact: Yungang LI

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摘要： 用循环伏安法、计时电位法、计时电流法对710℃温度下的NaCl-KCl-CuCl熔盐体系中铜的电化学还原机理和电结晶过程进行了研究，结果表明：Cu的电化学还原过程是由离子的扩散速度和电子得失速度混合控制的准可逆过程；其还原机理是Cu++e-→Cu；电结晶过程为接近半球形三维晶核的瞬间成核过程；组成为XNaC: XKCl :XCuCl =1:1:0.01的熔盐体系中Cu离子的扩散系数为4.3×10-4cm?s-1。

Abstract: The electrochemical reaction mechanism and electrocrystallization process of Cu on copper electrode in the eutectic NaCl-KCl-CuCl molten salt were investigated by means of cyclic voltammetry, chronopotentiometry and chronoamperometry technique at 710 ℃. The results show that the electrochemical reaction process of Cu is a quasi-reversible process mix-controlled by Cu+ diffusion rate and electron transport rate; the electrochemical reduction mechanism is Cu++e→Cu; the electrocrystallization process of copper is an instantaneous hemispheroid three-dimensional nucleation process; the Cu+ diffusion coefficient is 4.3×10-4~cm2•s-1 under the experimental conditions.

Key words: NaCl-KCl-CuCl, Copper, Electrochemical reduction mechanism, Electrocrystallization process