Quasi-in-situ Observation of Interfacial Behaviours: Recrystallization and Grain Recombination during Micro-deformed Diffusion Bonding Process
Yu Peng, Shiwei Li, Feng Jin, Yipeng Chen, Wei Guo, Jiangtao Xiong, Jinglong Li
Fig. 10 Schematic diagram showing the characteristic and evolution of interfacial microstructure for 304 stainless steel joints diffusion bonded at increasing temperature