Dynamic Recrystallization Behavior of Bimodal Size SiCp-Reinforced Mg Matrix Composite during Hot Deformation

Cui-Ju Wang, Kun-Kun Deng, Shan-Shan Zhou, Wei Liang

Fig. 11 SEM images of the microstructures of S-1.5 + 10-8.5 composite compressed at 320 °C and 0.01 s-1 to the strain of 0.2 a, 0.3 b and 0.5 c, d