Dynamic Recrystallization Behavior of Bimodal Size SiCp-Reinforced Mg Matrix Composite during Hot Deformation

Cui-Ju Wang, Kun-Kun Deng, Shan-Shan Zhou, Wei Liang

Fig. 10 a SEM image of the microstructure of S-1.5 + 10-8.5 composite at the strain of 0.1 (compressed at 320 °C and 0.01 s-1) and the magnified images of the regions Ab and Bc in Fig. 10a