陶瓷基复合材料辅助脉冲电流液相扩散连接的界面反应及接头强化机制
吴铭方1,刘飞2,王凤江1(
),乔岩欣1
),乔岩欣1
INTERFACIAL REACTION AND STRENGTHENING MECHANISM OF CERAMIC MATRIX COMPOSITE JOINTS USING LIQUID PHASE DIFFUSION BONDING WITH AUXILIARY PULSE CURRENT
Mingfang WU1,Fei LIU2,Fengjiang WANG1(),Yanxin QIAO1
),Yanxin QIAO1
图3. Cu/Zr接头微观形貌及元素线分布的EPMA分析
Fig.3. Microstructures (a, c) and element distributions by EPMA analysis (b, d) at interface on Cu/Zr joints bonding at 870 ℃ for 10 min with (a, b) and without (c, d) auxiliary pulse current
