[1] K. Kawano, O. Mitomi and M. Saruwatari, J Lightwave Technology 4 (1986) 1407.
[2] Y.M. Cheung and C.H. Yiu, Proc 4th Int Symp on Electronic Materials and Packaging (Taiwan, 2002) p.197.
[3] Y. Maeda, H. Oomori, S. Yoshikawa, M. Ichino, H. Tanaka,T. Mizue, H. Ishibashi, M. Shigematsu, T. Takayama, I. Tonal and N.Nishiyama, SEI Technical Review 62 (2006) 48.
[4] M.K. Song, IEEE Trans Components, Packaging, and Manufacturing Technology---Part B 19 (1996) 758.
[5] Y. Hsu, J.H. Kuang, Y.C. Tsai and W.H. Cheng, IEEE J Selected Topics in Quantum Electronics 12 (2006) 961.
[6] M. Bergoglio, A. Calcatelli and G. Rumiano, Vacuum 46 (1995) 763.
[7] U. Walchli, A.L. Stockli, F. Rapp, M.A. Bosch and A.Schmid, J Vacuum Sci Technol A 14 (1996) 1247.
[8] K. Kato and I. Nishi, IEEE Photonics Technol Lett 2 (1990) 473.
[9] L. Li, Optics and Lasers in Engineering 34 (2000) 231.
[10] J.H. Kuang, M.T. Sheen, S.C. Wang, G.L. Wang and W.H.Cheng, IEEE Trans Adv Packaging 24 (2001) 81.
[11] W.S. Chang and S.J. Na, J Mater Process Technol 120 (2002) 208.
[12] Y.F. Tzeng, J Mater Process Technol 102 (2000) 40.
[13] A. Kaplan, J Phys D: Appl Phys 27 (1994) 1805.
[14] Y. Bao, K. Inoue, Y. Takahashi, T. Tsumura, G.F. Zhang and P.L. Jiang, ISIJ Int 40 (2000) S1.
[15] J.F. Harris and J.J. Riley, Weld J 40 (1961)363.
[16] W.F. Hess and W.J. Childs, Weld J 27 (1947)712s.
[17] C.L. Tsai, O.A. Jammal, C. Papritan and D.W. Dickinson, Weld J 71 (1992) 47s.
[18] X. Sun, Weld J 79 (2000) 244s.
[19] Nizamettin Kahraman, Mater Design 28 (2007)420.
[20] J.G. Kaiser, G.J. Dunn and T.W. Eagar, Weld J 61 (1982) 167s.
[21] S. Aslanlar, Mater Design 27 (2006) 125.
[22] S. Aslanlar, A. Ogur, U. Ozsarac, E. Ilhan and Z. Demir, Mater Design 28 (2007) 2.
[23] D. Ozyurek, Mater Design 29 (2008)597.
[24] K.J. Ely and Y. Zhou, Sci Technol Weld Join 6 (2001) 37.
[25] S.A Gedeon and T.W. Eagar, Metall Trans B 17 (1986) 887.
[26] N. Harlin, T.B. Jones and J.D. Parker, J Mater Process Technol 143-144 (2003) 448.
[27] Department of Defense, ``Test Method Standard for Microcircuits", MIL-STD-883E, (1996), Method 1014.10 Seal part.
[28] K.B. Min, K.S. Kim and S.S. Kang, J Mater Process Technol 101 (2000) 186.
[29] K.B. Min and S.S. Kang, J Mater Process Technol 103 (2000) 218. |