Improving Li Plating Behaviors Through Cu-Sn Alloy-Coated Current Collector for Dendrite-Free Lithium Metal Anodes

doi:10.1007/s40195-020-01022-2

金属学报英文版 ›› 2021, Vol. 34 ›› Issue (3): 354-358.DOI: 10.1007/s40195-020-01022-2

收稿日期:2019-10-21 修回日期:2019-12-20 出版日期:2021-03-10 发布日期:2021-03-10

Improving Li Plating Behaviors Through Cu-Sn Alloy-Coated Current Collector for Dendrite-Free Lithium Metal Anodes

Yifeng Cheng¹^,², Xi Ke¹^,², Zhicong Shi¹^,²()

¹Smart Energy Research Centre, School of Materials and Energy, Guangdong University of Technology, Guangzhou, 510006, China
²Guangdong Engineering Technology Research Center for New Energy Materials and Devices, Guangzhou, 510006, China

Received:2019-10-21 Revised:2019-12-20 Online:2021-03-10 Published:2021-03-10
Contact: Zhicong Shi
About author:Zhicong Shi, zhicong@gdut.edu.cn

摘要/Abstract

Abstract:

Alloy anode with good reversibility of lithium plating/stripping and long cycling stability is considered as promising anode materials. Here, Cu-Sn alloy is used as the substrate for Li deposition to induce the most densely packed arrangement of Li atoms, thus presenting high lithiophilicity and improving Li plating behaviors. The LiFePO₄-based full cell with the as-prepared dendrite-free Li metal anode retained at 85 mAh g^-1 with a high coulombic efficiency of 99.5% after 300 cycles, presenting a capacity retention of 79.4%. This strategy provides a new perspective to structure dendrite-free Li anode for the next-generation high-energy density batteries.

Key words: Li metal anodes, Dendrite-free, Composite electrode, Lithiophilic surface

. [J]. 金属学报英文版, 2021, 34(3): 354-358.

Yifeng Cheng, Xi Ke, Zhicong Shi. Improving Li Plating Behaviors Through Cu-Sn Alloy-Coated Current Collector for Dendrite-Free Lithium Metal Anodes[J]. Acta Metallurgica Sinica (English Letters), 2021, 34(3): 354-358.

图/表 4

Fig. 1 SEM images of a Cu foam b Cu-Sn-decorated Cu foam (inset showing the morphology of Cu foam at high magnification and the digital photograph of Cu-Sn-decorated Cu foam). c TEM image and the corresponding d Cu, e Sn, f overlapping element mapping images. g XRD patterns of Cu foam and Cu-Sn-decorated Cu foam

Fig. 2 SEM images of Li deposition on the Cu-Sn-decorated Cu foam substrate after a 0.5 mAh cm-2, b 1.5 mAh cm-2, c 3 mAh cm-2 of Li plating. SEM images of Li deposition on the Cu foam substrate after d 0.5 mAh cm-2, e 1.5 mAh cm-2, f 3 mAh cm-2 of Li plating

Fig. 3 a Coulombic efficiency (CE) of Cu foam and Cu-Sn-decorated Cu foam. b Impedance spectra of Cu foam and Cu-Sn-decorated Cu foam at 1.5 mA cm-2 after 120 cycles. c Electrochemical performance of full cell with LiFePO4 cathodes using Cu foam and Cu-Sn-decorated Cu foam as current collector at 5 C, d their voltage profiles for the 300th cycle

Fig. 4 SEM morphologies of a Cu foam/Li anode b Cu-Sn-decorated Cu foam from a full cell with LiFePO4 cathode after 300 cycles

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Improving Li Plating Behaviors Through Cu-Sn Alloy-Coated Current Collector for Dendrite-Free Lithium Metal Anodes

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