Electrodeposition of aluminum on aluminum surface from molten salt

doi:10.11890/1006-7191-116-443

Acta Metallurgica Sinica (English Letters) ›› 2011, Vol. 24 ›› Issue (6): 443-448.DOI: 10.11890/1006-7191-116-443

Electrodeposition of aluminum on aluminum surface from molten salt

Wenmao Huang（黄文貌）¹,Xiangyu Xia（夏翔宇）¹,²,Bin Liu（刘斌）¹,²,Yu Liu（刘预）¹,²,Haowei Wang（王浩伟）¹,²,Naiheng Ma（马乃恒）¹

1. 上海交通大学
2.

收稿日期:2011-03-07 修回日期:2011-06-29 出版日期:2011-12-25 发布日期:2011-12-22
通讯作者: Naiheng Ma（马乃恒）

Electrodeposition of aluminum on aluminum surface from molten salt

Wenmao HUANG, Xiangyu XIA, Bin LIU, Yu LIU,Haowei WANG,Naiheng MA

State Key Laboratory of Metal Matrix Composites, Shanghai Jiao Tong University, Shanghai 200240, China

Received:2011-03-07 Revised:2011-06-29 Online:2011-12-25 Published:2011-12-22
Contact: Naiheng MA

摘要/Abstract

摘要： 本文研究了经过简单研磨和磷化处理后的铝片在8:1:1（质量比）AlCl3-NaCl-KCl的无机熔盐中的电沉积。采用扫描电子显微镜（SEM）和能谱分析仪（EDS）对镀层的表面形态、微观结构及物相组成进行观察和分析。采用急冷却法分析了镀层的结合力。结果表明，经过两种表面处理后的铝片上所沉积的镀层致密、连续且与基体结合较好。经过简单研磨后得到的镀层平均厚度为12μm，经磷化处理后得到镀层平均厚度则为9μm。四甲基氯化铵（TMAC）的添加有效地抑制了枝晶的生长，阳极活化则提高了镀层的结合力。结合力分析显示镀层与基体结合得较好。同时在铝基复合材料上电沉积铝也初步取得了较好的效果。

Abstract: The surface morphology, microstructure and composition of the aluminum coating of the electrodeposition plates in AlCl₃-NaCl-KCl molten salt with a mass ratio of 8:1:1 were investigated by SEM and EDS. The binding force was measured by splat-cooling method and bending method. The results indicate that the coatings with average thicknesses of 12 and 9 μm for both plates treated by simple grinding and phosphating are compacted, continuous and well adhered respectively. Tetramethylammonium chloride (TMAC) can effectively prevent the growth of dendritic crystal, and the anode activation may improve the adhesion of the coating. Binding force analysis shows that both aluminum coatings are strongly adhered to the substrates.

Key words: Aluminum, Electrodeposition, Surface morphology, Molten salt

Wenmao Huang（黄文貌） Xiangyu Xia（夏翔宇） Bin Liu（刘斌） Yu Liu（刘预） Haowei Wang（王浩伟） Naiheng Ma（马乃恒）. Electrodeposition of aluminum on aluminum surface from molten salt[J]. Acta Metallurgica Sinica (English Letters), 2011, 24(6): 443-448.

Wenmao HUANG, Xiangyu XIA, Bin LIU, Yu LIU,Haowei WANG,Naiheng MA. Electrodeposition of aluminum on aluminum surface from molten salt[J]. Acta Metallurgica Sinica (English Letters), 2011, 24(6): 443-448.

参考文献

[1] C.K. Fang, C.C. Huang and T.H. Chuang, J Mater Sci 30 (1999) 643.

[2] Z.Y. Tian, Met Mater Metall Eng 36 (2008) 3.

[3] D. Zhang, G.D. Zhang and Z.Q. Li, Mater China   29 (2010) 1.

[4] J. Hu, Y.B. Li and H.L. Wang, Mater Lett   62 (2008) 1715.

[5] C.Y. Wang, G.H. Wu and Q. Zhang, J Chin Soc Corros Prot 28 (2008) 59.

[6] H.J. Greene and F. Mansfeid, Corrosion 53 (1997) 920.

[7] B. Torres, M. Campo and A. Urena, Surf Coat Technol 201 (2007) 7552.

[8] C.L. He, D.Y. Lou, J.M. Wang and Q.K. Cai, Thin Solid Film   519 (2011) 4759.

[9] H.J. Greene and F. Mansfeld, Corrosion 53 (1997) 920.

[10] Q.Z. Li, Y.M. Tang and Y. Zuo, Mater Chem Phys 120 (2010) 676.

[11] A. Pardo, M.C. Merino, R. Arrabal, F. Viejo, M. Carboneras and J.A. Munoz, Corros Sci 48 (2006) 3035.

[12] S.W. Tang, J. Hu and X.H. Zhao, Corros Sci 53 (2011) 2636.

[13] S. Candan, Corros Sci 51 (2009) 1392.

[14] A.J. Lopez, A. Urena, M.D. Lopez and J. Rams, Surf Coat Technol 202 (2008) 755.

[15] M. Shahid, J Mater Sci Lett 32 (1997) 3775.

[16] A.J. Trowsdale, B. Noble, S.J. Harris, I.S.R. Gibbins,G.E. Thompson and G.C. Wood, Corros Sci 38 (1996) 177.

[17] J. Zhu and L.H. Hihara, Corros Sci 52 (2010)406.

[18] L.P. Zhang, X.J. Yu and Y.H. Dong, Trans Nonferrous Met Soc China 20 (2010) s245.

[19] L. Barchi, U. Bardi and S. Caporali, Prog Org Coat 67 (2010) 146.

[20] S. Caporali, A. Fossati and A. Lavacchi, Corros Sci 50 (2008) 534.

[21] S.M. Zhang and Y.Q. Zhou, Corros Prot 2 (2000)57.

[22] Q.F. Li and Z.X. Qiu, Rare Met Mater Eng 24 (1995) 59.

[23] P. Rolland and G. Mamantov, J Electrochem Soc 123 (1976) 1299.

[24] W.D. Yang, J.F. Huanga and L.Y. Cao, Inorg Chem Ind 41 (2009) 1.

[25] X.P. Wang and S. Tian, Rare Met Mater Eng 34 Suppl (2005) 716.

[26] J.S. Li, Z.H. Yang and X.H. Wang, J Central South Univ(Sci Technol) 39 (2008) 672.

[27] T. Tetsuya, N. Toshiyuki and I. Yasuhiko, Electrochim Acta 47 (2002) 2817.

[28] Q.Y. Feng, Z.M. Ding and L.S. Jia, Mater Prot 37 (2004) 1.

Electrodeposition of aluminum on aluminum surface from molten salt

Electrodeposition of aluminum on aluminum surface from molten salt

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