Acta Metallurgica Sinica (English Letters) ›› 2011, Vol. 24 ›› Issue (2): 155-160.DOI: 10.11890/1006-7191-112-155

• 研究论文 • 上一篇    下一篇

Tensile Behavior of Sn-0.7Cu with Zn addition at Various Deformation Temperatures

罗忠兵,王来   

  1. 大连理工大学材料科学与工程学院
  • 收稿日期:2010-12-01 修回日期:2011-02-21 出版日期:2011-04-25 发布日期:2011-04-20
  • 通讯作者: 王来

Tensile behavior of Sn-0.7Cu with Zn addition at various deformation temperatures

Zhongbing LUO, Jie ZHAO, Junshan ZHANG,Lai WANG   

  1. School of Materials Science and Engineering, Dalian University of Technology, Dalian 116085, China
  • Received:2010-12-01 Revised:2011-02-21 Online:2011-04-25 Published:2011-04-20
  • Contact: Lai WANG

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Abstract: The tensile behavior of Sn-0.7Cu and Sn-0.7Cu-1Zn was compared at various deformation temperatures. Refined microstructure and γ-CuZn particles were discovered with Zn addition. The strengths of Zn-containing solder were higher than that of Sn-0.7Cu at room and subzero temperatures. With the elevation of deformation temperature, they both decreased and they were nearly the same at 80℃. The works of fracture exhibited the similar evolution law. For Sn-0.7Cu solder, the elongation after fracture was smaller and the reduction of area was bigger than those of Sn-0.7Cu-1Zn. This shows that Zn addition improved the deformation stability, which is attributed to the modification of the microstructure. Dimples in fracture surface became smaller and shallower with the decreasing temperature. Ductile fracture was discovered in all the samples.

Key words: Sn-0.7Cu, Zn, Tensile, Temperature, Strength, Ductility, Fracture