Electrodeposition of aluminum on aluminum surface from molten salt
Wenmao HUANG, Xiangyu XIA, Bin LIU, Yu LIU,Haowei WANG,Naiheng MA
State Key Laboratory of Metal Matrix Composites, Shanghai Jiao Tong University, Shanghai 200240, China
Abstract The surface morphology, microstructure and composition of the aluminum coating of the electrodeposition plates in AlCl3 -NaCl-KCl molten salt with a mass ratio of 8:1:1 were investigated by SEM and EDS. The binding force was measured by splat-cooling method and bending method. The results indicate that the coatings with average thicknesses of 12 and 9 μ m for both plates treated by simple grinding and phosphating are compacted, continuous and well adhered respectively. Tetramethylammonium chloride (TMAC) can effectively prevent the growth of dendritic crystal, and the anode activation may improve the adhesion of the coating. Binding force analysis shows that both aluminum coatings are strongly adhered to the substrates.
Key words ： Aluminum
Electrodeposition
Surface morphology
Molten salt
Received: 2011-03-07;
Published: 2011-12-22
Corresponding Authors: Naiheng MA
E-mail: nhma@sjtu.edu.cn
References
[1]
[1] C.K. Fang, C.C. Huang and T.H. Chuang, J Mater Sci 30 (1999) 643.
[2]
[2] Z.Y. Tian, Met Mater Metall Eng 36 (2008) 3.
[3]
[3] D. Zhang, G.D. Zhang and Z.Q. Li, Mater China 29 (2010) 1.
[4]
[4] J. Hu, Y.B. Li and H.L. Wang, Mater Lett 62 (2008) 1715.
[5]
[5] C.Y. Wang, G.H. Wu and Q. Zhang, J Chin Soc Corros Prot 28 (2008) 59.
[6]
[6] H.J. Greene and F. Mansfeid, Corrosion 53 (1997) 920.
[7]
[7] B. Torres, M. Campo and A. Urena, Surf Coat Technol 201 (2007) 7552.
[8]
[8] C.L. He, D.Y. Lou, J.M. Wang and Q.K. Cai, Thin Solid Film 519 (2011) 4759.
[9]
[9] H.J. Greene and F. Mansfeld, Corrosion 53 (1997) 920.
[10]
[10] Q.Z. Li, Y.M. Tang and Y. Zuo, Mater Chem Phys 120 (2010) 676.
[11]
[11] A. Pardo, M.C. Merino, R. Arrabal, F. Viejo, M. Carboneras and J.A. Munoz, Corros Sci 48 (2006) 3035.
[12]
[12] S.W. Tang, J. Hu and X.H. Zhao, Corros Sci 53 (2011) 2636.
[13]
[13] S. Candan, Corros Sci 51 (2009) 1392.
[14]
[14] A.J. Lopez, A. Urena, M.D. Lopez and J. Rams, Surf Coat Technol 202 (2008) 755.
[15]
[15] M. Shahid, J Mater Sci Lett 32 (1997) 3775.
[16]
[16] A.J. Trowsdale, B. Noble, S.J. Harris, I.S.R. Gibbins,G.E. Thompson and G.C. Wood, Corros Sci 38 (1996) 177.
[17]
[17] J. Zhu and L.H. Hihara, Corros Sci 52 (2010)406.
[18]
[18] L.P. Zhang, X.J. Yu and Y.H. Dong, Trans Nonferrous Met Soc China 20 (2010) s245.
[19]
[19] L. Barchi, U. Bardi and S. Caporali, Prog Org Coat 67 (2010) 146.
[20]
[20] S. Caporali, A. Fossati and A. Lavacchi, Corros Sci 50 (2008) 534.
[21]
[21] S.M. Zhang and Y.Q. Zhou, Corros Prot 2 (2000)57.
[22]
[22] Q.F. Li and Z.X. Qiu, Rare Met Mater Eng 24 (1995) 59.
[23]
[23] P. Rolland and G. Mamantov, J Electrochem Soc 123 (1976) 1299.
[24]
[24] W.D. Yang, J.F. Huanga and L.Y. Cao, Inorg Chem Ind 41 (2009) 1.
[25]
[25] X.P. Wang and S. Tian, Rare Met Mater Eng 34 Suppl (2005) 716.
[26]
[26] J.S. Li, Z.H. Yang and X.H. Wang, J Central South Univ(Sci Technol) 39 (2008) 672.
[27]
[27] T. Tetsuya, N. Toshiyuki and I. Yasuhiko, Electrochim Acta 47 (2002) 2817.
[28]
[28] Q.Y. Feng, Z.M. Ding and L.S. Jia, Mater Prot 37 (2004) 1.
