Acta Metallurgica Sinica (English Letters) ›› 2019, Vol. 32 ›› Issue (12): 1537-1548.DOI: 10.1007/s40195-019-00910-6
Special Issue: 2019年钢铁材料专辑
• Orginal Article • Previous Articles Next Articles
Tong Xi1, Lu Yin1, Chun-Guang Yang1(), Ke Yang1()
Received:
2019-01-27
Revised:
2019-03-20
Online:
2019-12-10
Published:
2019-11-25
Tong Xi, Lu Yin, Chun-Guang Yang, Ke Yang. Hot Deformation Behavior and Processing Map of a Cu-Bearing 2205 Duplex Stainless Steel[J]. Acta Metallurgica Sinica (English Letters), 2019, 32(12): 1537-1548.
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Fig. 2 Initial microstructure a, XRD patterns b of as-received 2205-Cu DSS before hot deformation. The inset in a shows the magnification of initial microstructure
Fig. 10 Microstructure for 2205-Cu DSS obtained at 950 °C/0.01 s-1a, 1050 °C/0.01 s-1b, 1150 °C/0.01 s-1c, 950 °C/10 s-1d, 1050 °C/10 s-1e, 1150 °C/10 s-1f. Hereinto, black arrows denote the DRV in ferrite grains, and white arrows represent the DRX in austenite grain
Fig. 11 TEM images of the 2205-Cu DSS under different deformation conditions: a 950 °C/0.01 s-1, b 950 °C/10 s-1, c 1150 °C/0.01 s-1, d 1150 °C/10 s-1
Fig. 13 TEM bright field images of Cu-rich precipitates in 2205-Cu DSS under different deformation conditions: a 950 °C/10 s-1, b 1000 °C/10 s-1. The inset is the corresponding electron diffraction patterns of the matrix
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