Acta Metallurgica Sinica (English Letters) ›› 2017, Vol. 30 ›› Issue (9): 851-856.DOI: 10.1007/s40195-017-0605-4
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Noritake Hiyoshi1
Online:
2017-09-30
Published:
2017-10-26
About author:
1 The authors contributed equally to this work.
Noritake Hiyoshi. Crack Initiation and Propagation Evaluation for Sn-5Sb Solder Under Low-Cycle Fatigue[J]. Acta Metallurgica Sinica (English Letters), 2017, 30(9): 851-856.
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Sn | Ag | Cu | Sb | Bi | Pb | Zn | Fe | Al | As |
---|---|---|---|---|---|---|---|---|---|
Bal. | <0.0001 | 0.0002 | 4.9901 | 0.0002 | 0.003 | <0.0001 | 0.0006 | <0.0001 | 0.0024 |
Table 1 Chemical composition of Sn-5Sb solder (mass%)
Sn | Ag | Cu | Sb | Bi | Pb | Zn | Fe | Al | As |
---|---|---|---|---|---|---|---|---|---|
Bal. | <0.0001 | 0.0002 | 4.9901 | 0.0002 | 0.003 | <0.0001 | 0.0006 | <0.0001 | 0.0024 |
Strain rate, ε (%/s) | 0.01 | 0.1 | 0.5 | |||||||
---|---|---|---|---|---|---|---|---|---|---|
Strain range, Δε (%) | 0.5 | 0.3 | 0.5 | 1.0 | 0.5 | |||||
Ni: Crack initiation cycle Nf: Failure cycle | Ni | Nf | Ni | Nf | Ni | Nf | Ni | Nf | Ni | Nf |
88 | 2760 | 200 | 3111 | 100 | 3967 | 88 | 710 | 100 | 2870 |
Table 2 Crack initiation cycle and failure cycle for Sn-5Sb solder
Strain rate, ε (%/s) | 0.01 | 0.1 | 0.5 | |||||||
---|---|---|---|---|---|---|---|---|---|---|
Strain range, Δε (%) | 0.5 | 0.3 | 0.5 | 1.0 | 0.5 | |||||
Ni: Crack initiation cycle Nf: Failure cycle | Ni | Nf | Ni | Nf | Ni | Nf | Ni | Nf | Ni | Nf |
88 | 2760 | 200 | 3111 | 100 | 3967 | 88 | 710 | 100 | 2870 |
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